Optical semiconductor device and method for manufacturing same

An optical semiconductor device, comprising:

• a light emitting layer having a first major surface and a second major surface opposite to the first major surface;
• a first electrode provided on the second major surface;
• a second electrode provided on the second major surface;
• a transparent layer provided on the first major surface, the transparent layer being transparent, and the transparent layer laterally extending beyond the light emitting layer;
• a fluorescent layer provided on the transparent layer and containing phosphor,
• a first metal post provided on the first electrode;
• a second metal post provided on the second electrode;
• and
• a sealing layer provided on the second major surface, the sealing layer being formed of a material that is light-shielding with respect to a light emitted from the light emitting layer, the sealing layer sealing the first metal post and the second metal post, and the sealing layer covering a side surface of the light emitting layer,
• a side surface of the transparent layer having a portion that is not covered with the fluorescent layer and the sealing layer,
• a part of the light emitted from the light emitting layer propagating through the transparent layer and entering the fluorescent layer, and
• another part of the light emitted from the light emitting layer propagating through the transparent layer and emitted outside from the side surface of the transparent layer.

An optical semiconductor device, comprising:

• a light emitting layer having a first major surface and a second major surface opposite to the first major surface;
• a first electrode provided on the second major surface;
• a second electrode provided on the second major surface;
• a transparent layer provided on the first major surface, the transparent layer being transparent, and a side surface of the transparent layer protruding beyond a side surface of the light emitting layer;
• a fluorescent layer provided on the transparent layer and containing phosphor,
• a first metal post provided on the first electrode;
• a second metal post provided on the second electrode;
• and
• a sealing layer provided on the second major surface, the sealing layer being formed of a material that is light-shielding with respect to a light emitted from the light emitting layer, the sealing layer sealing the first metal post and the second metal post, and the sealing layer covering the side surface of the light emitting layer,
• the side surface of the transparent layer having a portion that is not covered with the fluorescent layer and the sealing layer,
• a part of the light emitted from the light emitting layer propagating through the transparent layer and entering the fluorescent, and
• another part of the light emitted from the light emitting layer propagating through the transparent layer and emitted outside from the side surface of the transparent layer.

A method for manufacturing an optical semiconductor device, comprising:

• removing a growth substrate from a light emitting layer while the light emitting layer is supported by a support member including a sealing layer, first metal posts and second metal posts, in a state that a support substrate is not stuck on the sealing layer of a light emitting member, the light emitting layer including a semiconductor stacked body epitaxially grown on the growth substrate, the light emitting member including the light emitting layer, a plurality of sets of a positive electrode and a negative electrode provided on a second major surface of the light emitting layer, the first metal posts provided on each of the positive electrodes, the second metal posts provided on each of the negative electrodes, and the sealing layer, an electric current to cause an emission of light from the light emitting layer is flown via the positive and negative electrodes, the second major surface being opposite to the substrate,
• forming a transparent layer on a first major surface side of the light emitting layer opposite to the second major surface after removing the growth substrate, the transparent layer being made of a material having a transparency;
• forming a fluorescent layer on the transparent layer, the fluorescent layer including a phosphor absorbing the light emitted from the light emitting layer and emitting a light having a wavelength which is different from a wavelength of the light emitted from the light emitting layer, and
• performing singulation for each of the sets of the positive electrode and the negative electrode.