Method, System, and Apparatus for Preparing Substrates and Bonding Semiconductor Layers to Substrates
AssigneePeregrine Semiconductor Corporation
InventorsHiroshi Domyo, Michael McCafferty, Alain Duvallet, Masaki Sato, Christopher O'Brien, Anthony Mark Miscione, George Imthurn
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Abstract
Embodiments of preparing substrates for subsequent bonding with semiconductor layer are described herein. A substrate may be prepared with one or more chemicals or a sacrificial layer to limit or remove substrate contaminants and reduce substrate surface damage. Other embodiments may be described and claimed.
Claims37
A method of preparing a surface an insulating substrate of semiconductor architecture prior to bonding with another layer, including:
- depositing a semiconductor layer on the substrate surface;
- and
- removing the deposited semiconductor layer from the substrate surface.
A method of preparing a surface of an insulating substrate, the substrate having a first diffusion level, including:
- depositing a layer of material on the substrate surface, the material having a second diffusion level, the second diffusion level greater than the first diffusion level;
- and
- removing the layer of deposited material from the substrate surface.
A method of forming a semiconductor architecture including a substrate bonded to a semiconductor layer, including:
- depositing a layer of material on the substrate surface, the material having a second diffusion level, the substrate has a first diffusion level;
- and the second diffusion level is greater than the first diffusion level;
- and
- removing the deposited material from the substrate surface.
A semiconductor architecture including:
- an insulating substrate, the substrate has a first diffusion level and one of surface contaminants and surface damage;
- and
- a semiconductor layer deposited on the substrate surface, the semiconductor having a second diffusion level, the second diffusion level is greater than the first diffusion level, wherein the subsequent removal of the semiconductor reduces the one of the surface contaminants and the surface damage.
Dependencies are inferred from the claim text.