Gas and moisture permeation barriers
AssigneeCheil Industries Inc.
InventorsXianghui Zeng, Lorenza Moro, Damien Boesch
Life of this patent
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Abstract
A gas and moisture permeation barrier stack deposited by both sputtering and atomic layer deposition techniques. In one embodiment, the barrier stack comprises a bottom barrier layer deposited on a substrate by sputtering and a top barrier layer deposited on the sputtered layer by atomic layer deposition. In one embodiment, the sputtered barrier layer has a water vapor transmission rate of about 10−5 gm/m2·day or lower, and the top barrier layer improves the water vapor transmission rate of the resulting two-layer barrier stack to about 10−6 gm/m2·day or lower.
Claims28
A composite article comprising:
- a substrate;
- and
- a barrier stack for protecting a surface of the substrate, the barrier stack comprising:
- a first barrier layer on the surface of the substrate, the first barrier layer being a sputtered barrier layer, and
- a second barrier layer on a surface of the first barrier layer, the second barrier layer being an atomic layer-deposited barrier layer,
- the first barrier layer being between the substrate and the second barrier layer,
- wherein the first barrier layer, in the absence of the second barrier layer, has a water vapor transmission rate of about 10−5 gm/m2·day or lower, and
- wherein the barrier stack has a water vapor transmission rate of about 10−6 gm/m2·day or lower.
A method for protecting a substrate from the permeation of moisture and gases, the method comprising:
- sputtering a first barrier layer on a substrate, wherein the sputtered first barrier layer has a water vapor transmission rate of about 10−5 gm/m2·day or lower, and
- depositing a second barrier layer on the first barrier layer by atomic layer deposition, to form a barrier stack having a water vapor transmission rate of about 10−6 gm/m2·day or lower.
A composite article comprising:
- a substrate;
- and
- a two-layer barrier stack for protecting a surface of the substrate, the barrier stack comprising:
- a bottom barrier layer on the surface of the substrate, the bottom barrier layer being a sputtered barrier layer having a water vapor transmission rate of about 10−5 gm/m2·day or lower, and
- a top barrier layer on a surface of the bottom barrier layer, the top barrier layer being an atomic layer-deposited barrier layer, wherein the two-layer barrier stack has a water vapor transmission rate of about 10−6 gm/m2·day or lower,
- wherein the bottom barrier layer has a film thickness of at least about 20 nm.
A multilayer composite article comprising:
- a substrate;
- a first two-layer barrier stack comprising a first barrier layer on a surface of the substrate, the first barrier layer being a sputtered barrier layer, and a second barrier layer on the first barrier layer and being an atomic layer-deposited barrier layer;
- and
- a second two-layer barrier stack comprising a third barrier layer comprising a sputtered barrier layer, and a fourth barrier layer on the third barrier layer and comprising an atomic layer-deposited barrier layer;
- wherein the second two-layer barrier stack is deposited on a surface of the first two-layer barrier stack.
Dependencies are inferred from the claim text.