Methods of using polished silicon wafer strips for euv homogenizer
AssigneeKLA-Tencor Corporation
InventorsDaimian Wang, Frank Chilese
Life of this patent
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Abstract
The present invention is a light homogenizer or light tunnel with highly reflective sides that enable the focusing of EUV illumination. The sides of the homogenizer are cut from a highly polished silicon wafer. The wafer is coated with a reflective coating before the strips are cut from the wafer. The invention also includes a method for flattening the strips and applying a backing to the strips enabling easier manipulation of the strips during assembly and use.
Claims25
A EUV light homogenizer for a EUV reticle inspection system comprising:
- a hollow four sided tunnel, wherein said four sided tunnel include four flat strips, each of said four flat strips having an inner surface and an outer surface;
- wherein each of said inner surfaces is coated with a high reflectivity coating;
- and, wherein said four strips are joined to form said four-sided tunnel.
A method of assembling a light tunnel for a EUV illumination reticle inspection system comprising:
- polishing a silicon wafer;
- coating said silicon wafer with a high reflectivity coating;
- cutting said silicon wafer into at least four strips, each of said at least four strips having a first side and a second side, wherein said high reflectivity coating is on said first side;
- applying mounting substrate to said second side of each of said at least four strips;
- flattening each of said at least four strips against a flat surface;
- and,
- assembling said at least four strips to form said light tunnel;
- wherein each first side of said at least four strips forms a single interior surface of said light tunnel.
Dependencies are inferred from the claim text.