Method for ultrasonic bonding having at least one first and second ultrasonic transducer generating harmonic oscillating parts
AssigneeHesse GmbH
InventorsHans-Juergen Hesse, Michael Broekelmann
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AssigneeHesse GmbH
InventorsHans-Juergen Hesse, Michael Broekelmann
Estimating the term…
In a method for ultrasonic bonding, two longitudinal ultrasonic waves propagating in a common working plane oriented parallel to a substrate are induced in one or more ultrasonic transducers and are passed through ultrasound-conducting arms from different spatial directions onto a common connection point of the arms. At the connection point the ultrasonic waves cause an ultrasonic tool arranged directly or indirectly at said connection point to oscillate in two or three dimensions. At least one of the ultrasonic transducers induces an ultrasonic wave with a first harmonic oscillation component and a second oscillation component.
A method for ultrasonic bonding, wherein two longitudinal ultrasonic waves propagating in a common working plane oriented parallel to a substrate are induced in one or more ultrasonic transducers and are passed through ultrasound-conducting arms from different spatial directions onto a common connection point of the arms, and at the connection point cause an ultrasonic tool arranged directly or indirectly at said connection point to oscillate in two or three dimensions, the improvement wherein at least one of said ultrasonic transducers induces an ultrasonic ways with a first harmonic oscillation component and a second oscillation component.
Dependencies are inferred from the claim text.