Apparatus for mounting semiconductor chips on a circuit board

An apparatus for mounting semiconductor chips on a circuit board, comprising:

• a loading unit loading at least a circuit board and at least a plurality of semiconductor chips into the apparatus, the circuit board having an inner circuit pattern and a plurality of contact pads connected to the inner circuit pattern and the semiconductor chip having a plurality of contact terminals;
• a combining unit positioning the semiconductor chip onto a respective mounting area of the circuit board and combining the contact terminal of the semiconductor chip with the contact pad of the circuit board by using flux, the combining unit having a flux coater for coating the contact terminal with the flux and a flux controller for automatically supplementing the flux to the flux coater;
• and
• a bonding unit bonding the contact terminals of the semiconductor chip to the contact pads of the circuit board using a heat treatment.