Small Plasma Chamber Systems and Methods

A chamber, comprising:

• a substrate support disposed in the chamber, the substrate support configured for supporting a surface to be processed;
• a processing head disposed in the chamber, the processing head including an array of plasma microchambers, each of the plasma microchambers having an internal plasma volume and an open side, the open side of each of the plasma microchambers is configured to be disposed over at least a first portion of the surface to be processed, the open side of each of the plasma microchambers having an area that is less than an entire area of the surface to be processed;
• a process gas source, coupled to the chamber, so that a process gas is provided to each of the array of plasma microchambers, the process gas used to deposit a layer on the surface to be processed;
• and
• a radio frequency (RF) power supply connected to at least one electrode of the processing head, the array of plasma microchambers is configured to generate a plasma using the process gas to deposit the layer over the at least first portion of the surface to be processed.