Method for forming laminate
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsAtsushi Miyanari, Akihiko Nakamura
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Abstract
A release layer is adequately protected by a protective layer when a laminate is subjected to a desired treatment. A method for forming a laminate 10 includes a protective layer forming step of forming a protective layer 15 for covering a face that is a surface of a release layer 14 and which is not adhered to a support plate 12 and not superimposed at least on an adhesive layer 13; and a protective layer removal step of removing a portion of the protective layer 15, which is exposed at the time of forming the laminate 10.
Claims8
A method for forming a laminate comprising laminating a substrate, an adhesive layer, a release layer which is denatured upon absorption of light, and a support supporting the substrate in this order to form a laminate, the method including:
- a protective layer forming step of forming a protective layer for covering a face that is a surface of the release layer and which is not adhered to the support and not superimposed at least on the adhesive layer;
- and
- a protective layer removal step of removing a portion of the protective layer, which is exposed at the time of forming the laminate.
A method for forming a laminate comprising laminating a substrate, an adhesive layer, a release layer which is denatured upon absorption of light, and a support supporting the substrate in this order to form a laminate, the method including:
- a release layer removal step of removing a portion of the release layer, which is exposed at the time of forming the laminate, by a plasma treatment.
Dependencies are inferred from the claim text.