Copper plating solution
AssigneeHojin Platech Co., Ltd.
InventorsPan Soo Kim, Duk Haeng Lee, Woon Suk Jung
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Abstract
The present invention relates to a copper plating solution for relieving the deposit stress of an electroplated copper film. In the copper electroplating solution of the present invention, glycerin propoxylate ethoxylate is used as a carrier for relieving the deposit stress, and phenylurea is added as a deposit stress relieving additive. The copper electroplating solution of the present invention includes the phenylurea by from about 0.02 to about 0.08 g/l.
Claims9
A copper electroplating solution comprising a phenylurea as an additive for relieving deposit stress.
A copper electroplating method comprising:
- adding a phenylurea to a copper electroplating solution;
- and
- performing the copper electroplating to obtain a plated film having a less deformation as compared when the copper electroplating solution does not include the phenylurea.
Dependencies are inferred from the claim text.