Biosensor module comprising a biocompatible electrode
AssigneeNXP B.V.
InventorsRoel Daamen, Viet Hoang Nguyen
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Abstract
A method of manufacturing a module for a biosensor is disclosed. The method includes providing a substrate. The substrate includes a trench and a bond pad. The trench is filled with an electrically conductive material and the bond pad is arranged within the substrate. The method also includes removing a part of the electrically conductive material from the trench such that a recess is formed in a surface of the substrate, forming a biocompatible electrode in the recess, and removing a part of the substrate such that the bond pad is accessible through the surface of the substrate.
Claims14
A method of manufacturing a module for a biosensor, the method comprising
- providing a substrate, the substrate comprising a trench and a bond pad, wherein the trench is filled with an electrically conductive material and the bond pad is arranged within the substrate,
- removing a part of the electrically conductive material from the trench such that a recess is formed in a surface of the substrate,
- forming a biocompatible electrode in the recess, and
- removing a part of the substrate such that the bond pad is accessible through the surface of the substrate.
A module for a biosensor, the module comprising
- a substrate comprising a trench, a bond pad, and a cut-out portion, and
- a biocompatible electrode,
- wherein the trench contains an electrically conductive material in a lower portion of the trench the biocompatible electrode is formed in an upper portion of the trench and is in contact with the electrically conductive material in the lower portion of the trench, and wherein the bond pad is arranged within the substrate and is accessible through the cut-out portion.
Dependencies are inferred from the claim text.