Electronic component embedded substrate and manufacturing method thereof

An electronic component embedded substrate comprising:

• a first insulating layer having a first metal pattern on a lower surface and a second metal pattern on an upper surface and comprising a cavity passing through the upper surface and the lower surface;
• an electronic component having at least one external electrode on a surface and having at least a portion inserted in the cavity;
• a cavity plating portion formed on a surface of the cavity opposite to the external electrode to be electrically connected to at least one of the first metal pattern and the second metal pattern;
• a conductive filling portion formed by filling a conductive material between the cavity plating portion and the external electrode;
• a second insulating layer for covering exposed surfaces of the first metal pattern, the first insulating layer, the cavity plating portion, the conductive filling portion, and the electronic component;
• a first circuit pattern formed on a surface of the second insulating layer;
• and
• a via having one surface in contact with at least one area selected from at least a portion of the external electrode, at least a portion of the conductive filling portion, at least a portion of the cavity plating portion, and at least a portion of the first metal pattern portion in contact with the cavity plating portion, and the other surface in contact with the first circuit pattern.

A method of manufacturing an electronic component embedded substrate, comprising:

• providing a first insulating layer having a first metal pattern on a lower surface and a second metal pattern on an upper surface;
• forming a cavity in the first insulating layer and forming a cavity plating portion electrically connected to at least one of the first metal pattern and the second metal pattern by plating a conductive material on a surface of the cavity;
• attaching a detach film to a lower surface of the first metal pattern;
• attaching a lower surface of an electronic component to the detach film by inserting at least a portion of the electronic component having a plurality of external electrodes on a surface;
• forming a conductive filling portion by filling a conductive material between the cavity plating portion and the external electrodes;
• forming a third insulating layer by applying an insulating material on exposed surfaces of the second metal pattern, the first insulating layer, the cavity plating portion, the conductive filling portion, and the electronic component;
• processing a via hole, which exposes at least one area selected from at least a portion of the external electrodes, at least a portion of the conductive filling portion, at least a portion of the cavity plating portion, and at least a portion of the second metal pattern portion in contact with the cavity plating portion, through the third insulating layer;
• and
• filling a conductive material in the via hole and forming a second circuit pattern on an upper surface of the third insulating layer.

A method of manufacturing an electronic component embedded substrate, comprising:

• providing a first insulating layer having a first metal pattern on a lower surface and a second metal pattern on an upper surface;
• forming a cavity in the first insulating layer and forming a cavity plating portion electrically connected to at least one of the first metal pattern and the second metal pattern by plating a conductive material on a surface of the cavity;
• attaching a detach film to a lower surface of the first metal pattern;
• attaching a lower surface of an electronic component to the detach film by inserting at least a portion of the electronic component having a plurality of external electrodes on a surface;
• forming a conductive filling portion by filling a conductive material between the cavity plating portion and the external electrodes;
• forming a third insulating layer by applying an insulating material on exposed surfaces of the second metal pattern, the first insulating layer, the cavity plating portion, the conductive filling portion, and the electronic component;
• forming a second insulating layer by applying an insulating material on the exposed surfaces of the first metal pattern, the first insulating layer, the cavity plating portion, the conductive filling portion, and the electronic component after removing a detach film;
• forming a first via passing through the second insulating layer and a first circuit pattern provided on a lower surface of the second insulating layer to be connected to the first via;
• and
• forming a third via passing through the third insulating layer and a second circuit pattern provided on an upper surface of the third insulating layer to be connected to the third via, wherein one surface of the first via is in contact with at least one area selected from at least a portion of the external electrodes, at least a portion of the conductive filling portion, at least a portion of the cavity plating portion, and at least a portion of the first metal pattern portion in contact with the cavity plating portion, and
• one surface of the third via is in contact with at least one area selected from at least a portion of the external electrodes, at least a portion of the conductive filling portion, at least a portion of the cavity plating portion, and at least a portion of the second metal pattern portion in contact with the cavity plating portion.