US 2014/0151103 A1 · LAMINATED CHIP ELECTRONIC COMPONENT, BOARD FOR MOUNTING THE SAME, AND PACKING UNIT THEREOF

Abstract

A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer.

Claims36

Dependent claims

1-17. (canceled)

A laminated chip electronic component for mounting on a printed circuit board (PCB) via solder, the solder contacting the laminated chip electronic component and the PCB, the laminated chip electronic component comprising:

(i) a ceramic body including:
an active region, in which a plurality of internal electrodes are alternately disposed in a mutually opposing manner and dielectric layers are interposed between the internal electrodes to form capacitance;
an upper cover layer on an upper surface of the uppermost internal electrode of the active region;
and
a lower cover layer on a lower surface of the lowermost internal electrode of the active region and having a thickness greater than that of the upper cover layer;
and
(ii) first and second external electrodes on the ceramic body, wherein the plurality of internal electrodes are alternately connected to the first and second external electrodes respectively, and
such that the center of the active region in the thickness direction is above the center of the ceramic body in the thickness direction;
and
wherein a point of maximum deflection at each side of the ceramic body in the length direction when an external voltage is applied to the active region is at or above the level of the height of the solder in the thickness direction.

7 more elements

(i) a ceramic body including:
an active region, in which a plurality of internal electrodes are alternately disposed in a mutually opposing manner and dielectric layers are interposed between the internal electrodes to form capacitance;
an upper cover layer on an upper surface of the uppermost internal electrode of the active region;
and a lower cover layer on a lower surface of the lowermost internal electrode of the active region and having a thickness greater than that of the upper cover layer;
and
(ii) first and second external electrodes on the ceramic body,
wherein the plurality of internal electrodes are alternately connected to the first and second external electrodes respectively, and
wherein the center of the active region in the thickness direction is above the center of the ceramic body in the thickness direction;
and
such that a point of inflection at each side of the ceramic body, at which the ceramic body switches between expansion and contraction thereof when an external voltage is applied to the active region, is at or below the level of the height of the solder in the thickness direction.

7 more elements

A laminated chip electronic component comprising:

(i) a ceramic body including:
an active region, in which a plurality of internal electrodes are alternately disposed in a mutually opposing manner and dielectric layers are interposed between the internal electrodes to form capacitance;
an upper cover layer on an upper surface of the uppermost internal electrode of the active region;
and
a lower cover layer on a lower surface of the lowermost internal electrode of the active region and having a thickness greater than that of the upper cover layer;
and
(ii) first and second external electrodes on the ceramic body, wherein the plurality of internal electrodes are alternately connected to the first and second external electrodes respectively, and
wherein the center of the active region in the thickness direction is above the center of the ceramic body in the thickness direction, such that a point of maximum deflection at each side of the ceramic body in the length direction when an external voltage is applied to the active region is at or above the level of the center of the ceramic body in the thickness direction.

5 more elements

A laminated chip electronic component comprising:

(i) a ceramic body including:
an active region, in which a plurality of internal electrodes are alternately disposed in a mutually opposing manner and dielectric layers are interposed between the internal electrodes to form capacitance;
an upper cover layer on an upper surface of the uppermost internal electrode of the active region;
and
a lower cover layer on a lower surface of the lowermost internal electrode of the active region and having a thickness greater than that of the upper cover layer;
and
(ii) first and second external electrodes on the ceramic body,
wherein the plurality of internal electrodes are alternately connected to the first and second external electrodes respectively,
wherein the center of the active region in the thickness direction is above the center of the ceramic body in the thickness direction, such that a point of inflection at each side of the ceramic body, at which the ceramic body switches between expansion and contraction thereof, when an external voltage is applied to the active region, is at or below the level of the center of the ceramic body in the thickness direction.

6 more elements

Dependencies are inferred from the claim text.

Laminated chip electronic component, board for mounting the same, and packing unit thereof

Life of this patent

Laminated chip electronic component, board for mounting the same, and packing unit thereof

Life of this patent

Abstract

Claims36