Back to results
US 2014/0151100 A1Published application
Electronic component embedded printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYeon Seop YU, Moon II Kim, Jun Young Kim
Life of this patent
Estimating the term…
Abstract
An electronic component embedded printed circuit board includes a core having a cavity; an electronic component inserted in the cavity; insulating layers laminated on top and bottom of the core and mixed with a coupling agent, which has functional groups respectively acting on an organic material and an inorganic material, to be bonded to an outer peripheral surface of the electronic component; and circuit patterns provided on the insulating layers.
Claims11
An electronic component embedded printed circuit board comprising:
- a core having a cavity;
- an electronic component inserted in the cavity;
- insulating layers laminated on top and bottom of the core and mixed with a coupling agent, which has functional groups respectively acting on an organic material and an inorganic material, to be bonded to an outer peripheral surface of the electronic component;
- and
- circuit patterns provided on the insulating layers.
2 more elements
Dependencies are inferred from the claim text.