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US 2014/0151099 A1Published application
Wiring board and laser drilling method thereof
AssigneeUnimicron Technology Corp.
InventorsCHENG MING WENG, WEI-MING CHENG, HAN-PEI HUANG
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Abstract
A laser drilling method of a wiring board is provided. In the method, a laser beam shines on a wiring substrate including an insulating layer to remove a portion of the insulating layer. The wiring substrate is placed in a focus section of the laser beam. The focus section contains a central region, an optical axis located in the central region, and a peripheral region surrounding the central region. The maximum light intensity of the focus section is located in the peripheral region.
Claims14
A laser drilling method of a wiring board, comprising:
- shining a laser beam on a wiring substrate comprising an insulating layer to remove a portion of the insulation layer, wherein the wiring substrate is placed in a focus section of the laser beam, the focus section having a central region, an optical axis located in the central region, and a peripheral region surrounding the central region, a maximum light intensity of the focus section appeared in the peripheral region.
A wiring board, comprising:
- an insulation layer:
- two wiring layers, the insulation layer disposed between the wiring layers;
- and
- at least a conductor, disposed in the insulation layer, and electrically connected to the wiring layer, wherein the conductor has a first end and a second end opposite to the first end, the width of the first end being larger than the width of the second end, and the ratio of the width of the second end to the width of the first end being larger than or equal to 0.75.
1 more element
Dependencies are inferred from the claim text.