Low temperature/high temperature solder hybrid solder interconnects

A hybrid solder structure, comprising:

• a bond pad;
• a high temperature solder ball attached to the bond pad;
• and
• a low temperature solder material disposed on at least a portion of the high temperature solder ball not attached to the bond pad.

A method of fabricating a microelectronic structure, comprising:

• forming a microelectronic package having at least one high temperature solder ball attached to at least one microelectronic package bond pad;
• disposing a low temperature solder material on the at least one high temperature solder ball;
• forming a microelectronic substrate having at least one microelectronic substrate bond pad;
• and
• attaching the microelectronic package to the microelectronic substrate by reflowing the at least one high temperature solder ball to form a hybrid solder interconnect extending between the at least one microelectronic package bond pad and the at least one microelectronic substrate bond pad.

A method of fabricating a microelectronic structure, comprising:

• forming a microelectronic package having at least one high temperature solder ball attached to at least one microelectronic package bond pad;
• forming a microelectronic substrate having at least one microelectronic substrate bond pad;
• disposing a low temperature solder material on the at least one microelectronic substrate bond pad;
• and
• attaching the microelectronic package to the microelectronic substrate by reflowing the at least one high temperature solder ball to form a hybrid solder interconnect extending between the at least one microelectronic package bond pad and the at least one microelectronic substrate bond pad.

A method of fabricating a microelectronic structure, comprising:

• forming a microelectronic package having at least one microelectronic package bond pad;
• disposing a low temperature solder material on the at least one microelectronic package bond pad;
• attaching at least one high temperature solder ball to the low temperature solder material and then reflowing to form at least one hybrid solder structure;
• forming a microelectronic substrate having at least one microelectronic substrate bond pad;
• and
• attaching the microelectronic package to the microelectronic substrate by reflowing the at least one hybrid solder structure to form a hybrid solder interconnect extending between the at least one microelectronic package bond pad and the at least one microelectronic substrate bond pad.