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US 2014/0151095 A1Published application
Printed circuit board and method for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSuk Hyeon Cho, Tae Hong Min, Seung Yeop Kook, Jung Han Lee, Hye Jin Kim
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Abstract
Disclosed herein is a printed circuit board, including: a composite sheet including an insulating material and a glass plate bonded to the insulating material; and a circuit layer formed on the composite sheet.
Claims18
A printed circuit board, comprising:
- a composite sheet including an insulating material and a glass plate bonded to the insulating material;
- and
- a circuit layer formed on the composite sheet.
A method for manufacturing a printed circuit board, comprising:
- preparing a composite sheet in which a glass plate is bonded to an insulating material;
- forming a seed layer on the composite sheet;
- forming a plating resist having an opening for circuit formation on the seed layer;
- forming a plating layer in the opening by a plating process;
- and
- removing the plating resist.
3 more elements
Dependencies are inferred from the claim text.