Printed circuit board and method for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsWoon Chul CHOI, Hwan Soo Lee, Hye Yeon Cha
Life of this patent
Estimating the term…
Abstract
Disclosed herein are a printed circuit board, including: a substrate having a patterned circuit layer on one surface thereof; and a resist pattern having a pattern corresponding to the circuit layer and covering the circuit layer so as to close the circuit layer, wherein a width of the resist pattern covering an upper portion of the circuit layer is the same as that of the resist pattern covering a lower portion of the circuit layer, and a method for manufacturing the same.
Claims12
A printed circuit board, comprising:
- a substrate having a patterned circuit layer on one surface thereof;
- and
- a resist pattern having a pattern corresponding to the circuit layer and covering the circuit layer so as to close the circuit layer,
- wherein a width of the resist pattern covering an upper portion of the circuit layer is the same as that of the resist pattern covering a lower portion of the circuit layer.
A method for manufacturing a printed circuit board, the method comprising:
- preparing an insulating film in which a resist layer having a predetermined thickness is applied onto an upper surface of a base substrate;
- patterning the resist layer according to a predetermined pattern to form a resist pattern;
- preparing a substrate having a circuit layer formed thereon, disposing the resist pattern and the circuit layer so as to face each other, and then adhering the insulating film and the substrate to each other;
- and
- separating the base substrate from the resist pattern.
A method for manufacturing a printed circuit board, the method comprising:
- preparing an insulating film in which a resist layer having a predetermined thickness is applied onto an upper surface of a base substrate and processing a reference hole in a specific position of the insulating film;
- patterning the resist layer according to a predetermined pattern to form a resist pattern;
- preparing a substrate having a reference pin formed in a position corresponding to the reference hole and a circuit layer, disposing the resist pattern and the circuit layer so as to face each other, and then adhering the insulating film and the substrate to each other by coinciding the reference hole with the reference pin;
- and
- removing the base substrate and the reference pin.
Dependencies are inferred from the claim text.