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US 2014/0151009 A1Published application
Thermal interface element and method of preparation
AssigneeGeneral Electric Company
InventorsRaj Bahadur, David Mulford Shaddock
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Abstract
An article and method of assembling the article is disclosed. The method of assembling includes positioning a pre-fabricated thermal interface element between a heat source and a heat-sink. The pre-fabricated thermal interface element includes an indium substrate and a plurality of nanosprings disposed on the indium substrate.
Claims11
A method of assembling an article, comprising:
- positioning a pre-fabricated thermal interface element between a heat source and a heat-sink, wherein the pre-fabricated thermal interface element comprises a plurality of nanosprings disposed on an indium substrate.
A thermal interface element, comprising a pre-formed structure of a plurality of free-standing inorganic nanosprings disposed on an indium substrate.
A thermal interface element, consisting essentially of:
- an indium substrate, and
- a plurality of free-standing inorganic nanosprings disposed on the substrate.
Dependencies are inferred from the claim text.