Peeling apparatus, peeling system and peeling method

A peeling system comprising:

• a carry-in/out station configured to dispose a superimposed substrate in which a first substrate and a second substrate are bonded;
• a substrate conveyance apparatus configured to convey the superimposed substrate disposed in the carry-in/out station;
• and
• a peeling station configured to separate the superimposed substrate conveyed by the substrate conveyance apparatus into the first substrate and the second substrate,
• wherein the peeling apparatus includes:
• a first holding unit configured to hold a first substrate of the superimposed substrate;
• a second holding unit configured to hold the second substrate of the superimposed substrate and to move the second substrate in a direction of separating the second substrate from a surface of the first substrate;
• and
• a peeling inducing unit configured to form an area where the second substrate starts to be peeled off from the first substrate on a side surface of the superimposed substrate,
• wherein the second holding unit includes:
• a first suction moving unit configured to suck a circumferential edge portion of the second corresponding to the area formed by the peeling inducing unit and to move the circumferential edge portion in a direction of separating the circumferential edge portion from the surface of the first substrate, and
• a second suction and moving unit configured to suck a region which is closer to a central portion of the second substrate than to the circumferential edge portion of the second substrate and to move the region in a direction of separating the region from the surface of the first substrate.

A peeling method comprising:

• holding, by a first holding unit, a first substrate of a superimposed substrate in which the first substrate and a second substrate are bonded, the first holding unit being configured to hold the first substrate;
• forming, by a peeling inducing unit, an area where the second substrate starts to be peeled off from the first substrate on a side surface of the superimposed substrate, thereby inducing peeling, the peeling inducing unit being configured to form the area;
• sucking, by a first suction and moving unit, a circumferential edge portion of the second substrate corresponding to the area and moving the circumferential edge portion in a direction of separating the circumferential edge portion from a surface of the first substrate, the first suction and moving unit being configured to suck and move the circumferential edge portion in the direction of separating the circumferential edge portion from the surface of the first substrate;
• and
• sucking, by a second suction and moving unit, a region which is closer to a central portion of the second substrate than to the circumferential edge portion of the second substrate and moving the region in a direction of separating the region from the surface of the first substrate, the second suction and moving unit being configured to suck and move the region in the direction of separating the region from the surface of the first substrate.