Peeling apparatus, peeling system and peeling method

A peeling system comprising:

• a carry-in/out station configured to dispose a superimposed substrate in which a first substrate and a second substrate are bonded;
• a substrate conveyance apparatus configured to convey the superimposed substrate disposed in the carry-in/out station;
• and
• a peeling station configured to separate the superimposed substrate conveyed by the substrate conveyance apparatus into the first substrate and the second substrate,
• wherein the peeling apparatus includes:
• a first holding unit configured to hold a first substrate of the superimposed substrate;
• a second holding unit configured to hold the second substrate of the superimposed substrate and move the second substrate in a direction of separating the second substrate from a surface of the first substrate;
• and
• a peeling inducing unit configured to form an area where the second substrate starts to be peeled off from the first substrate on a side surface of the superimposed substrate,
• wherein the peeling inducing unit includes:
• a sharp member;
• and
• a moving mechanism configured to move the sharp member toward a side surface portion of the second substrate adjacent to a bonding portion of the first substrate and the second substrate in the side surface of the superimposed substrate.

A peeling method comprising:

• holding, by a first holding unit, a first substrate of a superimposed substrate in which the first substrate and a second substrate are bonded, the first holding unit being configured to hold the first substrate;
• holding, by a second holding unit, the second substrate of the superimposed substrate and moving the second substrate in a direction of separating the second substrate from a surface of the first substrate, the second holding unit being configured to hold and move the second substrate in the direction of separating the second substrate from the surface of the first substrate;
• and
• forming, by a peeling inducing unit, an area where the second substrate starts to be peeled off from the first substrate on a side surface of the superimposed substrate by causing a sharp member of the peeling inducing unit to come into contact with a side surface portion of the second substrate adjacent to the bonding portion, thereby inducing peeling, the peeling inducing unit including the sharp member and a moving mechanism configured to move the sharp member toward a side surface portion of the second substrate adjacent to a bonding portion of the first substrate and the second substrate in the side surface of the superimposed substrate.