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US 2014/0150973 A1Published application
Epoxy resin composition and manufacturing method of bonding structure
AssigneeDenso Corporation
InventorsHiroyuki Okuhira, Akira Takakura, Hiroshi Katou
Life of this patent
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Abstract
An epoxy resin composition includes: epoxy resin as a main component; and diamine having phenylene oxide skeleton indicated by an equation of: A code of “X” is a hydrogen or a methyl group, and a suffix of “n” is an integer in a range between 1 and 10. In the above composition, the gelation time is short, compared with a case where the epoxy resin composition with using phenylene sulfide skeletal diamine as hardening agent of an epoxy resin.
Claims7
An epoxy resin composition comprising:
- epoxy resin as a main component;
- and
- diamine having phenylene oxide skeleton indicated by an equation of:
- wherein a code of “X” is a hydrogen or a methyl group, and
- wherein a suffix of “n” is an integer in a range between 1 and 10.
2 more elements
Dependencies are inferred from the claim text.