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US 2014/0150972 A1Published application
Temporary adhesion of chemically similar substrates
AssigneeWacker Chemie AG
InventorsAndreas Koellnberger, Frank Achenbach
Life of this patent
Estimating the term…
Abstract
A temporary adhesive for reversibly bonding a silicon wafer to a silicon support contains a crosslinkable organopolysiloxanes composition and a fatty acid or salt thereof or fatty acid ester as a release regulator having a density different from the crosslinkable organopolysiloxanes composition of at least 0.1 g/cm3, which upon parting of the wafer from the substrate, the adhesive remains substantially adhered to the substrate.
Claims5
1-4. (canceled)
A process for the temporary adhesive bonding of a silicon wafer to a silicon support, comprising applying an adhesive to the support, wherein
- the adhesive is a crosslinkable silicone composition comprising at least 0.01 to 10 wt % of release agents selected from the group consisting of fatty acids and their metal salts, fatty acid esters of saturated or unsaturated fatty acids, or a combination thereof,
- wherein the adhesion regulator (A) has at least a density difference of 0.10 g/cm3 as compared with the density of the silicone composition and as a result the adhesive force between the cured adhesive and the silicon support is greater by at least 0.5 N/mm than the adhesive force between the cured adhesive and the silicon wafer, measured according to DIN ISO 813, and the cured adhesive can be parted adhesively on at least 80% of the area only from the silicon wafer on parting of a bond between the silicon wafer and the silicon support.
A method for the temporary adhesive bonding of a silicon wafer to a silicon support, comprising:
- a) applying an adhesive to a silicon wafer, wherein the adhesive is a crosslinkable silicone composition comprising at least 0.01 to 10 wt % of release agents selected from the group consisting of fatty acids and their metal salts, fatty acid esters of saturated or unsaturated fatty acids, and combinations thereof,
- wherein the adhesion regulator (A) has at least a density difference of 0.10 g/cm3 as compared with the density of the silicone composition and as a result the adhesive force between the cured adhesive and the silicon support is greater by at least 0.5 N/mm than the adhesive force between the cured adhesive and the silicon wafer, measured according to DIN ISO 813, and the cured adhesive can be parted adhesively on at least 80% of the area only from the silicon wafer on parting of a bond between the silicon wafer and the silicon support,
- b) observing a waiting time of 10 seconds to 120 minutes wherein any solvent present is removed during the waiting time,
- d) contacting the silicon support with the adhesive,
- e) curing the adhesive,
- f) implementing further working steps on the silicon wafer and/or the silicon support,
- g) separating the silicon wafer and silicon support, with the cured adhesive remaining on the silicon support.
4 more elements
A method for the temporary adhesive bonding of a silicon wafer to a silicon support, comprising:
- a) applying an adhesive to a silicon wafer, wherein the adhesive is a crosslinkable silicone composition comprising at least 0.01 to 10 wt % of release agents selected from the group consisting of fatty acids and their metal salts, fatty acid esters of saturated or unsaturated fatty acids, and combinations thereof,
- wherein the adhesion regulator (A) has at least a density difference of 0.10 g/cm3 as compared with the density of the silicone composition and as a result the adhesive force between the cured adhesive and the silicon support is greater by at least 0.5 N/mm than the adhesive force between the cured adhesive and the silicon wafer, measured according to DIN ISO 813, and the cured adhesive can be parted adhesively on at least 80% of the area only from the silicon wafer on parting of a bond between the silicon wafer and the silicon support,
- b) observing a waiting time of 10 seconds to 120 minutes wherein any solvent present is removed during the waiting time,
- d) contacting the silicon support with the adhesive,
- e) curing the adhesive,
- f) implementing further working steps on the silicon wafer and/or the silicon support,
- g) separating the silicon wafer and silicon support, with the cured adhesive remaining on the silicon support,
- wherein the crosslinkable silicone composition is selected from the group consisting of condensation-crosslinking, addition-crosslinking, and peroxidically crosslinking silicone compositions.
5 more elements
Dependencies are inferred from the claim text.