Method of surface-treating metal component

Abstract

Provided is a method for surface-treating a metal component, whereby a pseudo-plated layer can be formed on a surface of a metal component, and quality equivalent to plating or other coating process can be obtained. The method includes a chamical polishing step scraping a surface of a base plate formed into a given shape through chemical polishing by 0.5 micrometer or more, and a heat treat pseudo-plating step forming a pseudo-plated layer on the surface through a heat treatment conducted by heating the base plate at a solution treatment temperature or above, for example, 850 degrees C. or above, preferably approximate 1040 degrees C., in a reducing atmosphere after the polishing step.

Dependencies are inferred from the claim text.