Plasma process apparatus and plasma process method
AssigneeTokyo Electron Limited
InventorsNaomi ONODERA, Kiyohiko GOKON, Jun SATO
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AssigneeTokyo Electron Limited
InventorsNaomi ONODERA, Kiyohiko GOKON, Jun SATO
Estimating the term…
A disclosed plasma process apparatus is disclosed that applies a plasma process to an object to be processed, including a cylindrical processing container configured to be evacuatable to vacuum, a holding unit configured to hold plural objects to be processed and inserted into and to be extracted from the cylindrical processing container, a gas supplying unit configured to supply a gas into the processing container, an activating unit configured to be located along a longitudinal direction of the processing container and to activate the gas by plasma generated by a high frequency power, a cylindrical shield cover configured to surround a periphery of the processing container and to be connected to ground for shielding from high frequency, and a cooling device configured to cause the cooling gas to flow through a space between the cylindrical shield cover and the cylindrical processing container during the plasma process.
A plasma process method of processing an object to be processed by a plasma process while enabling cooling of an inside of a plasma apparatus by taking in and exhausting a gas to evacuate an atmosphere of the inside, the plasma process method comprising:
Dependencies are inferred from the claim text.