Circuit assemblies including thermoelectric modules

A circuit assembly comprising:

• a circuit board;
• a thermoelectric module comprising:
• a first substrate defined by a portion of the circuit board;
• a second substrate disposed within a footprint of the circuit board;
• N-type and P-type thermoelectric elements disposed generally between the first and second substrates;
• at least one additional thermoelectric module coupled to the circuit board such that the circuit board defines part of the at least one additional thermoelectric module;
• wherein the circuit board can support at least one electrical component in a position spaced apart from the thermoelectric module.

A circuit assembly comprising:

• a circuit board;
• a thermoelectric module comprising:
• a first substrate defined by a portion of the circuit board;
• a second substrate disposed within a footprint of the circuit board;
• N-type and P-type thermoelectric elements disposed generally between the first and second substrates;
• electrical pathways configured to couple the thermoelectric elements to the circuit board, the electrical pathways being buried in the circuit board;
• wherein the circuit board can support at least one electrical component in a position spaced apart from the thermoelectric module;
• wherein the circuit board includes a base support, at least part of the base support being removed to thereby define an opening through the base support exposing the electrical pathways, the electrical pathways being configured to couple the thermoelectric elements to the circuit board through the opening defined in the base support of the circuit board.

A circuit assembly comprising:

• a circuit board comprising electrically conductive patterns and at least one electrical pathway;
• a substrate comprising electrically conductive patterns;
• and
• multiple N-type thermoelectric elements and multiple P-type thermoelectric elements disposed between the circuit board and the substrate and coupled to the electrically conductive patterns of the circuit board and the electrically conductive patterns of the substrate;
• wherein a portion of the circuit board comprising the electrically conductive patterns, the substrate, and the multiple N-type and P-type thermoelectric elements define a thermoelectric module on the circuit board, such that the circuit board forms an integral part of the thermoelectric module;
• wherein the at least one electrical pathway of the circuit board is coupled to the thermoelectric module;
• and
• wherein the circuit board can support at least one electrical component on the circuit board at a location spaced apart from the thermoelectric module.