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US 2014/0150560 A1Published application
MEMS Pressure Sensor Assembly with Electromagnetic Shield
AssigneeRobert Bosch GmbH
InventorsGary O'Brien, Ando Feyh, Andrew Graham
Life of this patent
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Abstract
A pressure sensor assembly includes a pressure sensor die and a circuit die. The pressure sensor die includes a MEMS pressure sensor and an electromagnetic shield layer. The circuit die includes an ASIC configured to generate an electrical output corresponding to a pressure sensed by the MEMS pressure sensor. The ASIC is electrically connected to the pressure sensor die. The electromagnetic shield is configured to shield the MEMS pressure sensor and the ASIC from electromagnetic radiation.
Claims20
A pressure sensor assembly comprising:
- a pressure sensor die including (i) a fixed electrode, (ii) a movable electrode located below the fixed electrode, and (iii) an electromagnetic shield located above the fixed electrode.
A pressure sensor assembly comprising:
- a pressure sensor die including a MEMS pressure sensor and an electromagnetic shield layer;
- and
- a circuit die including an ASIC configured to generate an electrical output corresponding to a pressure sensed by the MEMS pressure sensor, the ASIC being electrically connected to the pressure sensor die.
Dependencies are inferred from the claim text.