Apparatus and method for characterizing adhesive bonding and osseointegration

An apparatus for characterizing adhesive bonding, the apparatus comprising an acoustic wave sensor, the sensor comprising:

• a) a semiconductor substrate;
• b) a piezoelectric layer disposed on the substrate;
• c) a metallic layer disposed on the piezoelectric layer;
• and
• d) an input electrode and an output electrode disposed on the substrate, the electrodes disposed between the substrate and the piezoelectric layer.

A method for characterizing adhesive bonding, the method comprising the steps of:

• a) providing an acoustic wave sensor, comprising:
• i) a semiconductor substrate,
• ii) a piezoelectric layer disposed on the substrate,
• iii) a metallic layer disposed on the piezoelectric layer, and
• iv) an input electrode and an output electrode disposed on the substrate, the electrodes disposed between the substrate and the piezoelectric layer;
• b) placing the sensor between two surfaces or two materials to be adhered together;
• c) placing an adhesive layer between the two surfaces or two materials wherein an adhesive bond is formed between the two surfaces or two materials;
• d) exciting the sensor wherein the sensor generates acoustic waves wherein the acoustic waves propagate through the sensor and the adhesive layer;
• e) monitoring the acoustic waves;
• and
• f) determining the strength of the adhesive bond from the monitored acoustic waves.