Back to results
US 2014/0150552 A1Published application
Chip Level Sensor with Multiple Degrees of Freedom
AssigneeRobert Bosch GmbH
InventorsAndo Feyh, Po-Jui Chen
Life of this patent
Estimating the term…
Abstract
A sensing assembly device includes a substrate, a chamber above the substrate, a first piezoelectric gyroscope sensor positioned within the chamber, and a first accelerometer positioned within the chamber.
Claims20
A sensing assembly device comprising:
- a substrate;
- a chamber above the substrate;
- a first piezoelectric gyroscope sensor positioned within the chamber;
- and
- a first accelerometer positioned within the chamber.
2 more elements
A method of forming a sensing assembly device comprising:
- providing a substrate;
- forming a first piezoelectric gyroscope sensor above the substrate;
- forming a first accelerometer positioned above the substrate;
- and
- forming a chamber above the substrate such that the first piezoelectric gyroscope sensor and the first accelerometer are within the chamber.
2 more elements
Dependencies are inferred from the claim text.