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US 2014/0150540 A1Published application
Method of integrating a temperature sensing element
AssigneeSensata Technologies, Inc.
InventorsJoris Robert Jan Lenferink, Jorke Jellema, Paulus Thomas Johannes Gennissen
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Abstract
A multi-function sensor includes a body that includes a sensing circuit disposed on a substrate, the sensing circuit including a pressure sensor and a temperature sensor, the temperature sensor being disposed on a flexible portion of the substrate. A method of fabrication and additional embodiments are disclosed.
Claims20
A multi-function sensor comprising:
- a body comprising a sensing circuit disposed on a substrate, the sensing circuit comprising a pressure sensor and a temperature sensor, the temperature sensor being disposed on a flexible portion of the substrate.
A method for fabricating a multi-function sensor, the method comprising:
- selecting a sensing circuit at least partially disposed on a flexible substrate;
- mounting the sensing circuit into a body;
- flexing a portion of the substrate to orient at least one sensor;
- and
- capping the body and sensing circuit to provide the multi-function sensor.
2 more elements
A temperature and pressure sensor comprising:
- a body comprising a unitary sensing circuit disposed on a flexible substrate, the sensing circuit comprising a pressure sensor and a temperature sensor, wherein
- the pressure sensor is bonded to a carrier disposed between the pressure sensor and the substrate, such that the pressure sensor is oriented for being exposed to a volume for receiving a sampling environment;
- and
- the temperature sensor is oriented for protruding into the sampling environment.
1 more element
Dependencies are inferred from the claim text.