Cutting element and a method of manufacturing a cutting element
AssigneeSmith International, Inc.
InventorsLoel G. Corbett, J. Daniel Belnap
Life of this patent
Estimating the term…
Loading patent…
AssigneeSmith International, Inc.
InventorsLoel G. Corbett, J. Daniel Belnap
Estimating the term…
The present disclosure relates in one aspect to a cutting element comprising a substrate and a cutting layer disposed on a surface of the substrate. The cutting layer comprises an ultra hard material. The substrate comprises tungsten carbide and a metal binder. The substrate has a magnetic saturation value in the range of from 80 to less than 85%. In another aspect, the magnetic saturation value may increase within the substrate along a gradient, wherein proximal to the interface with the cutting layer, the substrate has a magnetic saturation value in the range of from 80 to less than 85%. Also included are drill bits incoiporating such cutting elements. Additionally, the present disclosure relates to methods of manufacturing cutting elements.
A method of manufacturing cutting elements comprising:
A method of manufacturing a cutting element comprising:
Dependencies are inferred from the claim text.