Electronic component mounting method and surface mounting apparatus
AssigneeYamaha Hatsudoki Kabushiki Kaisha
InventorDaisuke KASUGA
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AssigneeYamaha Hatsudoki Kabushiki Kaisha
InventorDaisuke KASUGA
Estimating the term…
An electronic component mounting method includes a removing step, a first mounting step, a first attaching step and a second mounting step. In the removing step, a first feeder holding first electronic components is removed from an attaching portion of a component feeding device when there is a reason for removing the first feeder from the attaching portion. In the first mounting step, electronic components other than the first electronic component, out of electronic components to be mounted on a board, are mounted on the board when the first feeder is removed from the attaching portion. In the first attaching step, the first feeder is attached to another attaching portion, to which no feeder is attached, after the removing step. In the second mounting step, the first electronic component is mounted on the board from the first feeder attached to the other attaching portion after the first attaching step.
An electronic component mounting method for mounting electronic components using a surface mounting apparatus including a base, a plurality of feeders holding a plurality of electronic components, a component feeding device with a plurality of attaching portions to which the feeders are to be mounted, a transport device for conveying a board onto the base, and a component mounting device for mounting the electronic components on the board conveyed onto the base from the feeders attached to the component feeding device, the electronic component mounting method comprising:
A surface mounting apparatus, comprising:
Dependencies are inferred from the claim text.