Adhesive-free carrier assemblies for glass substrates
AssigneeGeneral Electric Company
InventorsJie Jerry LIU, Jeffrey Michael YOUMANS
Life of this patent
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Abstract
The disclosure relates generally to carrier assemblies for handling and processing thin flexible glass. More particularly, the invention relates to an adhesive-free carrier assembly for handling thin flexible glass substrates that are used in organic opto-electronic devices such as OLEDs and organic photodetectors (OPDs).
Claims21
An adhesive free carrier assembly, comprising a rigid carrier and a flexible substrate, wherein the rigid carrier is directly attached to the flexible substrate without the use of an adhesive to form the adhesive free carrier assembly.
An adhesive free carrier assembly, comprising
- a rigid carrier having at least a portion of its perimeter etched to provide a step;
- and
- a flexible substrate,
- wherein the rigid carrier is directly contacted to the flexible substrate without the use of an adhesive to form the adhesive free carrier assembly, and
- wherein at least a portion of the flexible substrate is positioned above said step.
An adhesive free carrier assembly, comprising
- a rigid carrier having at least a portion of its perimeter etched to provide a step;
- and
- a decoupler covering a portion of the step;
- and
- a flexible substrate,
- wherein the rigid carrier is directly contacted to the flexible substrate without the use of an adhesive to form the adhesive free carrier assembly, and
- wherein at least a portion of the flexible substrate is positioned above said decoupler.
A method for handling and/or processing thin flexible substrates, said method comprising:
- a. providing a rigid carrier;
- b. providing a flexible substrate;
- c. directly contacting the rigid carrier onto the flexible substrate without the use of adhesive to form a carrier assembly;
- d. fabricating a device on top of the carrier assembly, wherein the device and flexible substrate are linked together;
- and
- e. decoupling the rigid carrier from the device-flexible substrate component.
Dependencies are inferred from the claim text.