Back to results
US 2014/0112824 A1Published application
Deposition Of Films Comprising Aluminum Alloys With High Aluminum Content
AssigneeApplied Materials, Inc.
InventorsDavid Thompson, Srinivas Gandikota, Xinliang Lu, Wei Tang, Jing Zhou, Seshadri Ganguli, Jeffrey W. Anthis, Atif Noori, Faruk Gungor, Dien-Yeh Wu, Mei Chang, Shih Chung Chen
Life of this patent
Estimating the term…
Abstract
Provided are films comprising aluminum, carbon and a metal, wherein the aluminum is present in an amount greater than about 16% by elemental content and less than about 50% carbon. Also provided are methods of depositing the same.
Claims20
A film comprising aluminum, carbon and a metal, wherein the aluminum is present in an amount greater than about 16% by elemental content and less than about 50% carbon.
A method of depositing a film, the method comprising:
- exposing a substrate surface to a metal halide precursor comprising a metal halide to provide a metal halide at the substrate surface;
- purging excess metal halide;
- exposing the substrate surface to one or more alkyl aluminum precursors comprising one or more of trimethyl aluminum, triethyl aluminum, dimethyaluminum hydride, diethylhydridoaluminum,
- methyldihydroaluminum, and an alkyl aluminum hydrides of the formula [(CxHy)3-aAlHa]n, wherein x has a value of 1 to 3, y has a value of 2x+2, a has a value of 1 to 2, and n has a value of 1 to 4.
1 more element
Dependencies are inferred from the claim text.