Three-dimensional backplane
AssigneeHuawei Technologies Co., Ltd.
InventorsSonghai CHEN, Shiping TANG
Life of this patent
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AssigneeHuawei Technologies Co., Ltd.
InventorsSonghai CHEN, Shiping TANG
Estimating the term…
An objective of the present invention is to provide a three-dimensional backplane to solve the problem that the number of layers of a printed circuit board for producing a backplane increases linearly along with the number of connectors. The three-dimensional backplane includes: a first group of connectors, a second group of connectors, a first group of printed circuit boards, and a second group of printed circuit boards. Any printed circuit board in the first group of printed circuit boards is connected to any printed circuit board in the second group of printed circuit boards. Any connector in the second group of connectors is connected to any connector in the first group of connectors. With the foregoing solution, the number of wires on each printed circuit board is reduced, so that the number of layers of a printed circuit board for producing a backplane is reduced.
A three-dimensional backplane, comprising:
Dependencies are inferred from the claim text.