Method for manufacturing a cap for a mems component, and hybrid integrated component having such a cap

A method for manufacturing hybrid integrated components at least including one ASIC component, one MEMS component, and one cap, the method comprising:

• initially processing an ASIC substrate to produce the functionality of a plurality of ASIC components situated in a grid;
• mounting a MEMS substrate on the processed front side of the ASIC substrate, the mounted MEMS substrate being structured, the micromechanical structure of a MEMS component, which extends over the entire thickness of the MEMS substrate, being produced above each ASIC component;
• structuring a cap substrate in the grid of the ASIC components and MEMS components;
• and
• mounting the cap substrate on the ASIC substrate above the grid of the MEMS components, and only then are the components separated;
• wherein the cap, which is for the MEMS component having at least one structural element which is deflectable perpendicularly with respect to the component plane, is made by performing the following:
• producing a cap structure in a flat cap substrate in a multistep anisotropic etching process, the cap structure including at least one mounting frame having at least one mounting surface and a stop structure, on the cap inner side, having at least one stop surface;
• masking a surface of the cap substrate for the multistep anisotropic etching process with at least two masking layers made of different materials;
• and
• selecting layouts of the at least two masking layers and a number and a duration of the etching steps so that the mounting surface, the stop surface, and the cap inner side are situated at different surface levels of the cap structure.

An inertial sensor component, comprising:

• one ASIC component;
• one MEMS component which is mounted on the front side of the ASIC component and whose micromechanical structure extends over the entire thickness of the MEMS component;
• and
• one cap which is mounted above the micromechanical structure of the MEMS component;
• wherein a stop structure having at least one stop surface for a deflectable structural element of the MEMS component is formed on the cap inner side, and
• wherein the at least one mounting surface of the cap, the at least one stop surface, and the cap inner side are situated at different surface levels.