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US 2013/0340806 A1Published application
Electrically conductive adhesive composition, connector and solar cell module
AssigneeHitachi Chemical Company, Ltd.
InventorsShinichirou Sukata, Hiroki Hayashi, Aya Momozaki
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Abstract
Provided is an electrically conductive adhesive composition including: electrically conductive particles (A) containing metal having a melting point of equal to or lower than 220° C.; a thermosetting resin (B); a flux activator (C); and a curing catalyst (D), in which a reaction start temperature of the thermosetting resin (B) and the curing catalyst (D) is 130 to 200° C.
Claims12
An electrically conductive adhesive composition comprising:
- electrically conductive particles (A) containing metal having a melting point of equal to or lower than 220° C.;
- a thermosetting resin (B);
- a flux activator (C);
- and
- a curing catalyst (D),
- wherein a reaction start temperature of the thermosetting resin (B) and the curing catalyst (D) is 130 to 200° C.
3 more elements
Dependencies are inferred from the claim text.