Method and apparatus for improved integrated circuit temperature evaluation and ic design
AssigneeAdvanced Micro Devices, Inc.
InventorRajit C. Chandra
Life of this patent
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Abstract
A method and apparatus generates thermal partitions for metal interconnects of an integrated circuit, based on interconnect self heat data and mutual heat data. Each of the thermal partitions includes data identifying thermally related interconnects and respective temperature values associated with each of the thermally related interconnects. Thermally related partitions that can be computed efficiently and simultaneously and the results then integrated using superposition for the full chips.
Claims25
A method, performed by an apparatus, for determining integrated circuit thermal values for metal interconnects comprising:
- generating thermal partitions for metal interconnects of the integrated circuit, based on interconnect self heat data and mutual heat data, wherein each of the thermal partitions comprises data identifying thermally related interconnects and respective temperature values associated with each of the thermally related interconnects.
A method carried out by one or more an apparatus, the method comprising:
- receiving initial model parameters that represent temperature fields associated with interconnects in an integrated circuit or package, receiving chip and/or package parameters and using at least the initial model parameters and the chip and/or package parameters to calculate one or more thermal partitions of the chip and/or package.
An apparatus for determining integrated circuit thermal values for metal interconnects comprising logic operative to generate thermal partitions for metal interconnects of the integrated circuit, based on interconnect self heat data and mutual heat data, wherein each of the thermal partitions comprises data identifying thermally related interconnects and respective temperature values associated with each of the thermally related interconnects.
An apparatus for determining integrated circuit thermal values for metal interconnects comprising logic operative to:
- receive initial model parameters that represent temperature fields associated with interconnects in an integrated circuit or package, receive chip and/or package parameters and use at least the initial model parameters and the chip and/or package parameters to calculate one or more thermal partitions of the chip and/or package.
A non-transitory computer readable medium comprising executable instructions stored therein that when executed by one or more processors, causes the one or more processors to:
- generate thermal partitions for metal interconnects of the integrated circuit, based on interconnect self heat data and mutual heat data, wherein each of the thermal partitions comprises data identifying thermally related interconnects and respective temperature values associated with each of the thermally related interconnects.
Dependencies are inferred from the claim text.