Latent hardener with improved barrier properties and compatibility
AssigneeTrillion Science, Inc.
InventorsYurong Ying, John J. McNamara, Jing Liang, Rong-Chang Liang
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Abstract
A curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct; compositions containing the curing agent and an epoxy resin; the compositions are useful in electronic displays, circuit boards, semi conductor devices, flip chips and other applications.
Claims16
-9. (canceled)
A composition comprising an epoxy resin and a curing agent that is comprised of the reaction product of:
- (a) an amine, and
- (b) an epoxy resin, and
- (c) an elastomer-epoxy adduct.
An electronic display comprising an electronic component affixed to a substrate by an epoxy adhesive wherein the epoxy adhesive incorporates the curing agent of claim 1.
A circuit board comprising an electronic component affixed to a board substrate with an epoxy adhesive, the epoxy adhesive incorporating the curing agent of claim 1.
A flip chip comprising an integrated circuit chip mounted to a substrate with an epoxy adhesive, wherein the epoxy adhesive comprises the curing agent of claim 1.
A semiconductor device comprising an electronic component affixed to a substrate with an epoxy adhesive wherein the epoxy adhesive includes the curing agent of claim 1.
A fixed array ACF comprising gold particles dispersed in the adhesive film in a predetermined pattern, the adhesive film comprising an epoxy adhesive and a curing agent wherein the curing agent is the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct.
Dependencies are inferred from the claim text.