Method of manufacturing electronic component module and electronic component module

A method of manufacturing an electronic component module comprising:

• a first step of sealing a surface of an aggregate substrate on which a plurality of electronic components are mounted with a sealing resin;
• a second step of cutting a boundary portion between electronic component modules from an outer surface of the sealing resin to a position where the aggregate substrate is cut at least partially through and forming a first groove;
• a third step of forming a shield layer by coating the outer surface of the sealing resin with a conductive resin and by filling the first groove with the conductive resin;
• and
• a fourth step of cutting the boundary portion between the electronic component modules from an outer surface side of the shield layer and singulating the aggregate substrate into the individual electronic component modules,
• wherein, in the third step, the quantity of the conductive resin with which the first groove is filled is adjusted in such a manner that a portion of the shield layer at a position where the first groove is formed dips, so that a recess is formed at the position on the shield layer where the first groove is formed, and
• wherein, in the fourth step, the boundary portion between the electronic component modules is cut along the recess from the outer surface side of the shield resin to the position where the aggregate substrate is cut at least partially through, a second groove having a width smaller than the width of the recess is formed, and the aggregate substrate is singulated into the individual electronic component modules.

An electronic component module comprising:

• a base substrate;
• a plurality of electronic components that are mounted on at least one surface of the base substrate;
• a sealing resin that seals the plurality of electronic components mounted on the one surface of the base substrate;
• and
• a shield layer that coats an outermost surface of the sealing resin and coats at least parts of side surfaces of the sealing resin,
• wherein the shield layer formed on each of the side surfaces of the sealing resin is formed in such a manner that the thickness of a portion of the shield layer adjacent to the outermost face of the sealing resin is smaller than the thicknesses of other portions of the shield layer.