Through-hole mounting system with heat sinking elements clamped to one another against insulating body

A system, comprising:

• a first electronic device that includes:
• a first insulating body;
• a first heat transfer surface exposed through a first surface of the first insulating body;
• and
• a plurality of first conductive leads extending from the first insulating body;
• a heat sink that includes:
• a first plate positioned adjacent to the first heat transfer surface of the first electronic device;
• a second plate, the first and second plate separated by the first electronic device;
• a plurality of attachment devices configured to attach the first plate to the second plate around the first electronic device.

A method, comprising:

• coupling a heat sink around a first electronic device, the first electronic device including a first insulating body, a heat transfer surface exposed through a first surface of the first insulating body, and a plurality of first conductive leads extending from the first insulating body, the coupling the heat sink including:
• positioning a first plate of the heat sink adjacent to the heat transfer surface of the first electronic device;
• positioning a second plate of the heat sink adjacent to a second surface of the first electronic device, the first and second plate separated by the first electronic device;
• attaching the first plate to the second plate around the first electronic device with a plurality of attachment devices.

A system, comprising:

• a first device including:
• a first insulating body configured to encapsulate a first die;
• a plurality of conductive leads projecting from the insulating body;
• and
• a first dissipation plate exposed from the insulating body, the first dissipation plate being configured to face outside of the insulating body;
• and
• a heat sink in contact with said first dissipation plate, the heat sink including:
• a first dissipation element;
• a second dissipation element;
• and
• clamping devices configured to attach the first dissipation element and the second dissipation element together against the insulating body of said first device.