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US 2013/0293772 A1Published application
Camera module
AssigneeLG Innotek Co., Ltd.
InventorMin Soo KIM
Life of this patent
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Abstract
An exemplary embodiment of the present disclosure includes a PCB mounted with an image sensor, a base installed at an upper surface of the PCB to centrally form an optical path, a lens holder coupled to an upper surface of the base to form an optical path by being mounted with at least one or more sheets of lenses, a variable lens arranged on the optical path centrally formed at the base to control a refractive index of passing light, and an infrared cut-off coating layer provided on a surface of the variable lens to filter an infrared component from the optical path-passing light.
Claims13
A camera module, the camera module comprising:
- a PCB (Printed Circuit Board) mounted with an image sensor;
- a base installed at an upper surface of the PCB to centrally form an optical path;
- a lens holder coupled to an upper surface of the base to form an optical path by being mounted with at least one or more sheets of lenses;
- a variable lens arranged on the optical path centrally formed at the base to control a refractive index of passing light;
- and
- an infrared cut-off coating layer provided on a surface of the variable lens to filter an infrared component from the optical path-passing light.
3 more elements
Dependencies are inferred from the claim text.