Exposure time selection using stacked-chip image sensors
AssigneeAptina Imaging Corporation
InventorsHonghong Peng, Brian Keelan
Life of this patent
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AssigneeAptina Imaging Corporation
InventorsHonghong Peng, Brian Keelan
Estimating the term…
Imaging systems may be provided with stacked-chip image sensors. A stacked-chip image sensor may include a vertical chip stack that includes an array of image pixels and processing circuitry. The image pixel array may be coupled to the processing circuitry through an array of vertical metal interconnects. The image pixel array may be partitioned into image pixel sub-arrays configured to capture image data using one or more integration times. The processing circuitry may determine motion information for the image data captured by each pixel sub-array and may determine integration times for each pixel sub-array. The pixel sub-arrays may capture additional image data using the determined integration times. The additional image data may be combined to generate final image frames having short integration pixel values and long integration pixel values. The processing circuitry may output the final image frames to off-chip image processing circuitry.
A method for operating a stacked-chip image sensor, wherein the stacked-chip image sensor comprises a planar array of image sensor pixels, an array of vertical conductive vias, and processing circuitry coupled to the planar array of image sensor pixels through the array of vertical conductive vias, the method comprising:
A method for operating a stacked-chip image sensor, wherein the stacked-chip image sensor comprises a planar array of image sensor pixels, an array of vertical conductive vias, and processing circuitry coupled to the planar array of image sensor pixels through the array of vertical conductive vias, the method comprising:
A system, comprising:
Dependencies are inferred from the claim text.