Contact release capsule useful for chemical mechanical planarization slurry
AssigneeGeneral Engineering & Research, L.L.C.
InventorRobin Ihnfeldt
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AssigneeGeneral Engineering & Research, L.L.C.
InventorRobin Ihnfeldt
Estimating the term…
The invention relates to a contact release capsule comprising a particle, a chemical payload, and a polymer coating, wherein the particle is impregnated with the chemical payload, and the chemical payload is held inside the particle by the polymer coating until the contact release capsule contacts a surface and a shearing force removes the polymer coating allowing the chemical payload to release outside the particle. The contact release capsule is useful in chemical mechanical planarization slurries. Particularly, the contact release capsule may comprise a glycine impregnated silica nanoparticle coated with a polymer, wherein the contact release capsule is dispersed in an aqueous solution and used in the copper chemical mechanical planarization process. Use of the contact release capsule in a slurry for copper chemical mechanical planarization may significantly improve planarization efficiency, decrease unwanted etching and corrosion, and improve dispersion stability.
A contact release capsule comprising a particle, a chemical payload, and a polymer coating, wherein:
A slurry comprising a mixture of contact release capsules and a liquid solution, wherein the contact release capsules comprise a particle, a chemical payload, and a polymer coating, wherein:
A method of planarizing and/or polishing a wafer surface comprising performing the chemical mechanical planarization process, wherein the slurry utilized in the process is the slurry comprising a mixture of contact release capsules and a liquid solution, wherein the contact release capsules comprise a particle, a chemical payload, and a polymer coating, wherein:
Dependencies are inferred from the claim text.