Method of pattering nonmetal conductive layer
AssigneeFar Eastern New Century Corporation
InventorsChien-Cheng CHANG, Yu-Chun CHIEN, Da-Shan LIN, Han-Hsiang LIN
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Abstract
A method of patterning a nonmetal conductive layer on a circuit board is provided. A nonmetal conductive layer and a negative photoresist layer are sequentially formed on a substrate of a circuit board. Then, the negative photoresist layer is exposed through a patterned photomask and then developed by a developing solution. Next, the nonmetal conductive layer is etched. The remained photoresist layer is finally removed by a non-alkaline stripper solution to obtain a patterned nonmetal layer on the substrate.
Claims17
A method of patterning a nonmetal conductive layer, comprising:
- forming a nonmetal conductive layer on a substrate;
- forming a negative photoresist layer on the nonmetal conductive layer, wherein a material of the negative photoresist layer is cyclized polyisoprene, an alkali-soluble acrylic resin, a copolymer containing hydroxystyrene monomer, or any combinations thereof;
- exposing the negative photoresist layer through a patterned photomask by a radiation light;
- developing the negative photoresist layer by a developing solution, which is xylene, phenylethane, toluene, or a combination thereof;
- etching the nonmetal conductive layer by an etching solution;
- and
- removing the exposed negative photoresist layer by a non-alkaline stripper or a solvent stripper.
Dependencies are inferred from the claim text.