Positive-type photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device including the cured film

Abstract

A positive-type photosensitive resin composition includes (A) an alkali-soluble resin, (B) a photosensitizer, and (C) a silicon compound shown by the following general formula (1). R1 represents an alkylene group having 6 to 8 carbon atoms, and R2 represents an alkyl group having 1 to 10 carbon atoms. The positive-type photosensitive resin composition exhibits excellent storage stability, produces a film that exhibits excellent adhesion to a substrate during development, and produces a cured film that exhibits excellent adhesion to a substrate after humidification. (R2O)3—Si—R1—Si—(OR2)3  (1)

Dependencies are inferred from the claim text.