Mask blank, transfer mask, method of manufacturing a transfer mask, and method of manufacturing a semiconductor device
AssigneeHoya Corporation
InventorsAtsushi KOMINATO, Masahiro HASHIMOTO, Osamu NOZAWA
Life of this patent
Estimating the term…
Loading patent…
AssigneeHoya Corporation
InventorsAtsushi KOMINATO, Masahiro HASHIMOTO, Osamu NOZAWA
Estimating the term…
A mask blank for use in the manufacture of a binary mask adapted to be applied with ArF excimer laser exposure light has, on a transparent substrate, a light-shielding film for forming a transfer pattern. The light-shielding film has a laminated structure of a lower layer and an upper layer and has an optical density of 2.8 or more for exposure light and a thickness of 45 nm or less. The lower layer is made of a material in which the total content of a transition metal and silicon is 90 at % or more, and has a thickness of 30 nm or more. The upper layer has a thickness of 3 nm or more and 6 nm or less. The phase difference between exposure light transmitted through the light-shielding film and exposure light transmitted in air for a distance equal to the thickness of the light-shielding film is 30 degrees or less.
A mask blank for use in the manufacture of a binary mask adapted to be applied with ArF excimer laser exposure light, the mask blank comprising, on a transparent substrate, a light-shielding film for forming a transfer pattern,
A binary transfer mask adapted to be applied with ArF excimer laser exposure light, the transfer mask comprising, on a transparent substrate, a light-shielding film having a transfer pattern,
Dependencies are inferred from the claim text.