Method for connecting substrates, and composite structure obtainable thereby
AssigneeFraunhofer-Gesellschaft zur Forderung der angewand ten Forschung e.V.
InventorsRalph Wilken, Jorg Ihde, Christoph Regula
Life of this patent
Estimating the term…
Abstract
The invention relates to a method for connecting substrates including depositing a plasma polymer layer on each of a first and a second substrate by means of atmospheric pressure plasma and bringing the plasma polymer layers in contact with each other. In a variant of the method, only the first substrate is provided with a plasma polymer layer and connected to a second substrate, the surface of which can react with the plasma polymer layer. The invention further relates to composite structures which can be obtained with such methods.
Claims31
A method for connecting substrates, comprising:
- (i) depositing a plasma polymer layer on each of a first and a second substrate by means of an atmospheric pressure plasma;
- and
- (ii) bringing the plasma polymer layers into contact.
A method for connecting substrates, comprising:
- (i) depositing a plasma polymer layer on a first substrate by means of an atmospheric pressure plasma;
- and
- (ii) bringing the plasma polymer layer into contact with a second substrate having a surface capable of reacting with the plasma polymer layer.
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
A composite structure comprising a first and a second substrate that are connected to each other via plasma polymer layers, wherein, apart from the plasma polymer layers, no further auxiliary agent is used to connect the substrates.
Dependencies are inferred from the claim text.