Heat-curing sealing compound compositions having fast skin formation and good storage stability

A heat-curing sealing compound composition, comprising:

• at least one epoxy resin (A) with an average of more than one epoxy group per molecule;
• at least one heat-activatable curing agent or accelerator (B) for epoxy resins;
• at least one polyurethane polymer (PUP) having isocyanate groups and
• at least one polyaldimine (PA) of formula (I)
• wherein
• A stands for the radical of an amine after removal of n-primary aliphatic amino groups and does not contain any active hydrogen atoms, n stands for 2-5, and
• R1 and R2 either,
• independently of one another, stand for a monovalent hydrocarbon radical each with 1 to 12 carbon atoms,
• or
• together stand for a divalent hydrocarbon radical with 4 to 12 carbon atoms, which is part of an optionally substituted carbocyclic ring having 5 to 8 carbon atoms;
• R3 stands for a hydrogen atom or an alkyl group or an aralkyl group or an alkoxycarbonyl group in particular having 1 to 12 carbon atoms;
• R4 and R5 either
• independently of one another, each stands for a monovalent aliphatic, cycloaliphatic or araliphatic radical having 1 to 20 carbon atoms, optionally containing heteroatoms in the form of an ether oxygen or a tertiary amine nitrogen,
• or
• together they stand for a divalent aliphatic radical having 3 to 20 carbon atoms, which is part of an optionally substituted heterocyclic ring having 5 to 8 ring atoms, preferably 6 ring atoms, wherein this ring optionally contains, in addition to the nitrogen atom, further heteroatoms in the form of ether oxygen or tertiary amine nitrogen.