Backplane module
AssigneeHewlett-Packard Development Company, L.P.
InventorsTsun-Yao Chang, David G. Rohrer
Life of this patent
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AssigneeHewlett-Packard Development Company, L.P.
InventorsTsun-Yao Chang, David G. Rohrer
Estimating the term…
Modules, modular devices, and modular systems are provided. Some examples include a backplane oriented in a first plane, a first module including a major surface oriented parallel to the first plane and a first minor surface oriented perpendicular to the first plane, wherein the major surface of the first module includes a connector thereon that releasably mates with a corresponding connector located on a first side of the backplane. Some examples include a second module including a major surface oriented perpendicular to the first plane and a first minor surface oriented parallel to the first plane, wherein the first minor surface of the second module includes a connector thereon that releasably mates with a corresponding connector located on a second side of the backplane. Circuitry within the first module can provide interconnections for the second module. The first and second modules can be fabric and interface modules, respectively.
A module, comprising:
A device, comprising:
A system, comprising:
Dependencies are inferred from the claim text.