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AssigneePowerchip Technology Corporation
InventorsAkira OGAWA, Yoshichika NAKAYA
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A semiconductor chip D1 of a flash memory which is stacked together with other semiconductor chips D2˜DN to form a multi-chip package (MCP), including a memory cell array 20 of the flash memory for storing an ID code and an upper address, wherein the ID code is written into the a fuse data region 20F of the memory cell array 20 before the assembly process. According to the invention, ID codes and upper addresses can be assigned and written to each of the semiconductor chips of a multi-chip package easily without increasing the size of the semiconductor chips in comparison with the prior art.
A semiconductor memory device which is stacked together with other semiconductor memory devices to form a multi-chip package, the semiconductor memory device comprising:
A writing method for writing an ID code and an upper address to a semiconductor memory device, which is stacked together with other semiconductor memory devices to form a multi-chip package, wherein the semiconductor memory device comprises a non-volatile memory means storing an ID code and an upper address, and
Dependencies are inferred from the claim text.